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  1. general description the cbt3245a provides eight bits of high-speed ttl-compatible bus switching. the low on resistance of the switch allows connections to be made with minimal propagation delay. the cbt3245a is organized as one 8-bit bus switches with one output enable (oe ) input. when oe is low, the switch is on and port a is connected to the b port. when oe is high, each switch is disabled. the cbt324 5a is characterized for operation from ? 40 ? c to +85 ? c. 2. features and benefits ? 5 ? switch connection between two ports ? ttl-compatible co ntrol input levels ? multiple package options ? latch-up protection exceeds 500 ma per jesd78 ? esd protection: ? hbm jesd22-a114f exceeds 2000 v ? mm jesd22-a115b exceeds 150 v ? cdm jesd22-c101c exceeds 1000 v 3. ordering information [1] also known as qsop20 package cbt3245a octal bus switch rev. 3 ? 5 january 2012 product data sheet table 1. ordering information type number package temperature range name description version cbt3245ad ? 40 ? c to +85 ? c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 cbt3245adb ? 40 ? c to +85 ? c ssop20 plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 cbt3245ads ? 40 ? c to +85 ? c ssop20 [1] plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm sot724-1 cbt3245apw ? 40 ? c to +85 ? c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 cbt3245abq ? 40 ? c to +85 ? c dhvqfn20 plastic dual-in-line co mpatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 ? 4.5 ? 0.85 mm sot764-1
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 2 of 16 nxp semiconductors cbt3245a octal bus switch 4. functional diagram 5. pinning information 5.1 pinning fig 1. logic diagram 001aao117 a1 18 b1 2 a8 11 b8 9 oe 19 fig 2. pin configuration for sot163-1 (so20), sot339-1 (ssop20) an d sot360-1 (tssop20) fig 3. pin configuration for sot724-1 (ssop20) cbt3245a n.c. v cc a1 oe a2 b1 a3 b2 a4 b3 a5 b4 a6 b5 a7 b6 a8 b7 gnd b8 aaa-001831 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 cbt3245a n.c. v cc a1 oe a2 b1 a3 b2 a4 b3 a5 b4 a6 b5 a7 b6 a8 b7 gnd b8 aaa-001832 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 3 of 16 nxp semiconductors cbt3245a octal bus switch 5.2 pin description 6. functional description [1] h = high voltage level; l = low voltage level; z = high-impedance off-state. (1) this is not a supply pin. the substrat e is attached to this pad us ing conductive die attach mate rial. there is no electrical or mechanical requirement to solder this pad. however, if it is soldered, the solder land should remain floating or be connected t o gnd. fig 4. pin configuration for sot764-1 (dhvqfn20) aaa-001833 cbt3245a transparent top view b7 gnd (1) a7 a8 b6 a6 b5 a5 b4 a4 b3 a3 b2 a2 b1 a1 oe gnd b8 n.c. v cc 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 10 11 1 20 terminal 1 index area table 2. pin description symbol pin description n.c. 1 not connected a1 to a8 2, 3, 4, 5, 6, 7, 8, 9 data input/output (a port) gnd 10 ground (0 v) b1 to b8 18, 17, 16, 15, 14, 13, 12, 11 data input/output (b port) oe 19 output enable input (active low) v cc 20 positive supply voltage table 3. function selection [1] input input/output oe an, bn lan = bn hz
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 4 of 16 nxp semiconductors cbt3245a octal bus switch 7. limiting values [1] stresses beyond those listed may cause permanent damage to t he device. these are stress ra tings only and functional operatio n of the device at these or any other cond itions beyond those indicated under section 8. is not implied. exposure to absolute-maximum-rated conditions for extended periods ma y affect device reliability. [2] the input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 8. recommended operating conditions 9. static characteristics table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). [1] t amb = ? 40 ? c to +85 ? c, unless otherwise specified. symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7.0 v v i input voltage [2] ? 0.5 +7.0 v i ok output clamping current v o <0v ? 50 - ma v o output voltage [2] ? 0.5 +7.0 v i o output current v o <0v - ? 128 ma i ik input clamping current v i =0v ? 50 - ma t stg storage temperature ? 65 +150 ?c table 5. operating conditions all unused control inputs of the device must be held at v cc or gnd to ensure proper device operation. symbol parameter conditions min typ max unit v cc supply voltage 4.0 - 5.5 v v ih high-level input voltage 2.0 - - v v il low-level input voltage - - 0.8 v t amb ambient temperature operating in free air ? 40 - +85 ?c table 6. static characteristics voltages are referenced to gnd (ground = 0 v). symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ [1] max v ik input clamping voltage v cc =4.5v; i i = ? 18 ma - - ? 1.2 v i i input leakage current v cc =5.5v; v i = gnd or 5.5 v - - ? 5 ? a i cc supply current v cc =5.5v; i o =0ma; v i =v cc or gnd -13 ? a ? i cc additional supply current per input pin; v cc = 5.5 v; one input at 3.4 v, other inputs at v cc or gnd [2] --3.5ma c i input capacitance control pins; v i =3v or 0v - 3.2 - pf c io(off) off-state input/output capacitance port off; v i = 3 v or 0 v; oe =v cc -6.6-pf
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 5 of 16 nxp semiconductors cbt3245a octal bus switch [1] all typical values are at v cc =5v, t amb =25 ? c. [2] this is the increase in supply current for each input th at is at the specified ttl voltage level rather than v cc or gnd. [3] measured by the voltage drop between the an and the bn termi nals at the indicated current through the switch. on resistance is determined by the lowest voltage of the two (an or bn) terminals. 10. dynamic characteristics [1] the propagation delay is the calculated rc ti me constant of the typical on resistanc e of the switch and the specified load c apacitance, when driven by an ideal volt age source (zero output impedance). [2] t pd is the same as t plh and t phl . t en is the same as t pzl and t pzh . t dis is the same as t plz and t phz . r on on resistance v cc =4.5v; v i =0v; i i =64ma [3] -57 ? v cc =4.5v; v i =0v; i i =30ma [3] -57 ? v cc =4.5v; v i =2.4v; i i = ? 15 ma [3] -1015 ? table 6. static characteristics ?continued voltages are referenced to gnd (ground = 0 v). symbol parameter conditions t amb = ? 40 ? c to +85 ?c unit min typ [1] max table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v). for test circuit see figure 7 . symbol parameter conditions t amb = ? 40 ? c to +85 ? c unit min max t pd propagation delay an, bn to bn, an; see figure 5 [1] [2] v cc = 5.0 v ? 0.5 v - 0.25 ns t en enable time oe to an or bn; see figure 6 [2] v cc = 5.0 v ? 0.5 v 1.0 5.9 ns t dis disable time oe to an or bn; see figure 6 [2] v cc = 5.0 v ? 0.5 v 1.0 6.0 ns
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 6 of 16 nxp semiconductors cbt3245a octal bus switch 11. waveforms measurement points are given in table 8 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 5. the data input (an, bn) to outp ut (bn, an) propagation delay times 001aam475 an, bn input bn, an output gnd v oh v m t plh t phl v m v ol v i measurement points are given in table 8 . logic levels: v ol and v oh are typical output voltage levels that occur with the output load. fig 6. enable and disable times 001aam476 oe input output low-to-off off-to-low output high-to-off off-to-high v i v m v ol v oh 3.5 v gnd gnd v m v x t plz t pzl t pzh t phz outputs disabled outputs enabled outputs enabled v y v m table 8. measurement points supply voltage input output v cc v i v m v m v x v y v cc = 5.0 v ? 0.5 v gnd to 3.0 v 1.5 v 1.5 v v ol + 0.3 v v oh ? 0.3 v
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 7 of 16 nxp semiconductors cbt3245a octal bus switch 12. test information test data is given in table 9 . all input pulses are supplied by generators having the following characteristics: prr ? 10 mhz; z o =50 ? . the outputs are measured one at a time with one transition per measurement. definitions for test circuit: r l = load resistance. c l = load capacitance including jig and probe capacitance. r t = termination resistance should be equal to output impedance z o of the pulse generator. v ext = external voltage for measuring switching times. fig 7. test circuit for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aae331 v ext v cc v i v o dut c l r t r l r l g table 9. test data supply voltage input load v ext v i t r , t f c l r l t plh , t phl t plz , t pzl t phz , t pzh v cc = 5.0 v ? 0.5 v gnd to 3.0 v ? 2.5 ns 50 pf 500 ? open 7.0 v open
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 8 of 16 nxp semiconductors cbt3245a octal bus switch 13. package outline fig 8. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z ywv references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 9 of 16 nxp semiconductors cbt3245a octal bus switch fig 9. package outline sot339-1 (ssop20) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p q (1) zywv references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 7.4 7.0 5.4 5.2 0.65 7.9 7.6 0.9 0.7 0.9 0.5 8 0 o o 0.13 1.25 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 sot339-1 mo-150 99-12-27 03-02-19 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 11 0 20 11 y 0.25 pin 1 index 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 5.3 mm sot339-1 a max. 2
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 10 of 16 nxp semiconductors cbt3245a octal bus switch fig 10. package outline sot724-1 (ssop20) unit a 1 a 2 a 3 h e l p b p cd (1) e (1) z (1) el y wv references outline version european projection issue date iec jedec jeita mm 0.25 0.10 1.55 1.40 0.25 0.31 0.20 0.25 0.18 8.8 8.6 4.0 3.8 0.635 1 6.2 5.8 0.89 0.41 1.67 1.28 8 0 o o 0.18 0.25 0.1 dimensions (millimetre dimensions are derived from the original inch dimensions) note 1. plastic or metal protrusions of 0.2 mm maximum per side are not included. sot724-1 01-07-04 03-02-18 w m b p d h e e z e c v m a x a y 1 10 20 11 a a 1 a 2 l p detail x l (a 3 ) mo-137 0 2.5 5 mm scale ssop20: plastic shrink small outline package; 20 leads; body width 3.9 mm; lead pitch 0.635 mm sot724-1 a max. 1.73 1/2 e
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 11 of 16 nxp semiconductors cbt3245a octal bus switch fig 11. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz ywv references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 11 0 20 11 pin 1 index a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 12 of 16 nxp semiconductors cbt3245a octal bus switch fig 12. package outline sot764-1 (dhvqfn20) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.6 4.4 d h 3.15 2.85 y 1 2.6 2.4 1.15 0.85 e 1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot764-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot764-1 dhvqfn20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 29 19 12 11 10 1 20 x d e c b a terminal 1 index area ac c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 13 of 16 nxp semiconductors cbt3245a octal bus switch 14. abbreviations 15. revision history table 10. abbreviations acronym description cdm charged device model esd electrostatic discharge dut device under test hbm human body model mm machine model prr pulse rate repetition ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes cbt3245a v.3 20120105 product data sheet - cbt3245a v.2 modifications: ? the format of this document has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? marking code removed from order information section. ? description of c i and c i/o corrected (errata). cbt3245a v.2 20020627 product data sheet - cbt3245a v.1 cbt3245a v.1 20020218 product data sheet - -
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 14 of 16 nxp semiconductors cbt3245a octal bus switch 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconducto rs products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
cbt3245a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2012. all rights reserved. product data sheet rev. 3 ? 5 january 2012 15 of 16 nxp semiconductors cbt3245a octal bus switch export control ? this document as well as the item(s) described herein may be subject to export control regu lations. export might require a prior authorization from competent authorities. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors cbt3245a octal bus switch ? nxp b.v. 2012. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 5 january 2012 document identifier: cbt3245a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 3 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 4 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 12 test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 14 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 contact information. . . . . . . . . . . . . . . . . . . . . 15 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16


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